Description
Copper plating machine is waiting for you.
Copper platingline is used for electroplating copper onto conductive metal substrates toimprove electrical conductivity, adhesion, and surface characteristics. Itprovides uniform copper deposition suitable for electronic components,connectors, printed circuit applications, and various industrial parts. Thesystem can be configured as rack, barrel, or continuous type, and is availablein manual, semi-automatic, or fully automated versions.
Machine Construction:
1. Frame:Made of Q235 100x100x4.0t square tube, surface is coated with an anti-corrosionprimer and an outer powder coating for enhanced durability and protection.
2. Tanks:PPmaterial (12mm/15mm/20mm thick) with tube reinforcement for extra durability.
3. Transport System: 1set PLC-controlled transporters for precise and automatic movement.
4. Air Agitation System: Provides uniform solution circulation and stable operation.
5. Spray Rinsing System: Automatically activated by the work piece lifting motion via asolenoid valve. This ensures targeted rinsing for superior cleaning while minimizing water consumption.
Specifications
Copper plating machine process includes Loading → Reverse current → Water rinse1/2 → Sulfuric acid 1 → Water rinse1/2 → Nickelplating → Water rinse → Sulfuric acid 2 → Copper plating → Water rinse → Unloading
Dimension L14,300xW6,500xH8000MM
Tanks dimension L3500xW800xH1350 mm
Copper heating/cooling Electric heating
Copper process time 60-90minuts
Total power consumption 95KW
Guarantee 1year
Optional Filter, Rectifier, Auto regeneration system; Coolingchiller; waste gas scrubber(acid fume treatment)
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