Description
Copper plating machine is waiting for you.
Copper platingline is used for electroplating copper onto conductive metal substrates toimprove electrical conductivity, adhesion, and surface characteristics. Itprovides uniform copper deposition suitable for electronic components,connectors, printed circuit applications, and various industrial parts. Thesystem can be configured as rack, barrel, or continuous type, and is availablein manual, semi-automatic, or fully automated versions.
Machine Construction:
1. Frame: Made ofQ235 100x100x4.0t square tube, surface is coated with an anti-corrosion primerand an outer powder coating for enhanced durability and protection.
2. Tanks: PPmaterial (12mm/15mm/20mm thick) with tube reinforcement for extra durability.
3. TransportSystem: 1set PLC-controlled transporters for precise and automatic movement.
4. Air AgitationSystem: Provides uniform solution circulation and stable operation.
5. Spray RinsingSystem: Automatically activated by the work piece lifting motion via asolenoid valve. This ensures targeted rinsing for superior cleaning whileminimizing water consumption.
Specifications
Copper plating machine process includes Loading → Reverse current → Water rinse1/2 → Sulfuric acid 1 → Water rinse1/2 → Nickelplating → Water rinse → Sulfuric acid 2 → Copper plating → Water rinse → Unloading
Dimension L24,300xW7,190xH8000MM
Tanks dimension L4200xW800xH1500 mm
Copper heating/cooling Electric heating
Copper process time 60-90minuts
Total power consumption 260KW
Guarantee 1year
Optional Filter, Rectifier, Auto regeneration system; Coolingchiller; waste gas scrubber(acid fume treatment)
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